Semiconductor packaging is inherently a multi-disciplinary engineering field that spans multiple engineering disciplines, making it challenging for individual lecturers to cover all aspects; effective education requires a multi-disciplinary approach that focuses on the underlying science rather than just manufacturing processes.
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Semiconductor Packaging: Missing Core Engineering Skills RevealedAdded:
What core skills do you feel that packaging engineers still lack today? I would think really is that this semiconductor packaging not are always taught in one engineering discipline.
But if you look at from the industry angle, semiconductor packaging is actually cut across different engineering discipline and it really hard for any lecturer to cover all the different angle. And and that that is where a lot of times what I'm trying to do here to put is a come in from a multi-discipline engineering angle to put the science behind semiconductor packaging.
Or rather than just going through how the panel or how the wafer level package is done. But what what is the science behind all these
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